ASM
Principal / Senior Engineer, Process Engineering (Advanced Packaging)
South Korea > HwaseongPosted 15 days ago
What you'd do
- Develop and optimize advanced packaging deposition processes including ALD, PECVD, PVD, and ECP
- Design DOE/RSM experiments and analyze materials characterization data
- Develop new films for emerging applications like W2W and D2W hybrid bonding
What they want
- Bachelor's, Master's, or PhD in Chemical Engineering, Materials Science, EE, or Physics
- Direct hands-on D2W or W2W hybrid bonding experience including surface prep
- 10+ years combined education and work experience in thin-film deposition
Nice to have
- Expertise in CoWoS, SoIC, or InFO advanced packaging integration flows
- Process and equipment qualification data feeding semiconductor PLC processes
- Experience with advanced metrology and inspection techniques