Applied Materials
Senior Process Engineer – Advanced Packaging Process (FabVantage)
Icheon-Gwango,KORPosted 24 days ago
What you'd do
- Lead advanced packaging process engagements with SK Hynix and Samsung Electronics.
- Resolve high-value process integration issues using FabVantage and AI-enabled tools.
- Define best practices for plating, hybrid bonding, CMP, CVD, PVD modules.
What they want
- Bachelor's or Master's in Engineering, Materials Science, or related discipline.
- 7+ years in semiconductor or advanced packaging industry.
- Deep understanding of HBM, 2.5D and 3D packaging, high-density interconnects.
Nice to have
- Hands-on advanced packaging process experience.
- AIx databases and digital FabVantage platform familiarity.